LED packaging equipment (bonding, optical packaging) – SSLnet Only

Plessey Purchases EVG Wafer Bonding System for MicroLED Array Fabrication

UK firm, Plessey Semiconductor reports that it has purchased a GEMINI wafer bonding system from EVG The company plans to use the system to scale up its fabrication of GaN-on-Si microLEDs. According to Plessey, the GEMINI® production wafer bonding system will perform bonding and alignment processes at Plessey’s fabrication facility in …

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Packaging Capacity Increase Planned at Everlight

LED packaging service provider Everlight Electronics plans to increase its monthly packaging capacity from 4.5 billion LED chips to 5.5 billion units, according to a Digitimes article. The company intends to use the additional capacity in particular for infrared devices, fine pixel pitch displays, and automotive lighting, according to the …

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VTT Technical Research Centre of Finland Fabricates Flexible LED Foil with Roll-to-roll Process

VTT Research Centre of Finland -- flexible LED foil produced with roll-to-roll overmolding process

The VTT Technical Research Centre of Finland reports that it for the first time was able to use a roll-to-roll process to perform all the manufacturing stages for a flexible in-molded LED foil. The demonstration’s purpose is to prove the suitability of the fabrication method for the highly cost-effective manufacture …

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A.L.P. Doubles Production Capacity for Moldable Optical Silicone

A.L.P. of Niles Illinois, reports that its LexaLite® brand, located in Charlevoix, Missouri has doubled its production capacity of Moldable Optical Silicone (MOS). The company has added a 240-ton tie-barless molding machine to its existing 180-ton molding system. According to A.L.P., both systems have advanced production features including coining technology, …

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Nichia Files Three Patent Lawsuits in Texas

On June 13, 2016, Nichia filed three separate patent lawsuits in the U.S. District Court for the Eastern District of Texas alleging infringement of its U.S. Patent No. 8,530,250. This patent describes a method of manufacturing a packaged LED that the patent abstract says is, “… a simple and low-cost method …

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Lextar to Move Packaging Capacity from Taiwan to Eastern China

Lextar Electronics, a vertically integrated company based in Taiwan, announced plans to move part of LED packaging capacity from Taiwan to its factory in Suzhou, eastern China, according to a Digitimes article. The company intends the relocation, which is scheduled for the end of June 2016, to reduce production cost. …

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Seoul Viosys Files Patent Lawsuit in Florida

Seoul Viosys, an associate company of Seoul Semiconductor, disclosed on Mar. 22 that last week they filed a patent infringement lawsuit in the Federal Court of State of Florida, USA, against Salon Supply Store, a producer of the UV-applied products. In the lawsuit, Seoul Viosys alleged that Salon Supply Store …

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Seoul Releases Wicop2 Technology for LED Lamps and Fixtures

Seoul Semiconductor announced a new, patented chip scale packaged product concept that the company calls Wicop. Wicop stands for Wafer Level Integrated Chip on PCB. In general LED chips that measure less than 1.2 times the chip’s length and width are considered ship scale packages. Seoul Semiconductor takes chip scale …

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Litecool Opens Packaging Lab

Litecool of Sheffield UK has opened a new clean room facility. The company says it intends to use the new facility to research, develop, prototype, and test new LED packaging technologies.  The laboratory the equipment required to mount bare LEDs into arrays, COBs, and packages. Litecool says the lab with …

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