Toyoda Gosei of Kiyosu, Japan reported that it will soon begin selling the glass-encapsulated ultraviolet LED products that the company developed in March of last year. The company is targeting their use as an industrial light source in the curing of resins, ink, and adhesives.
The company developed these UV-A LEDs using high-power blue LED technology from liquid crystal backlighting and lighting. Due to the complete encapsulation of the LED chip in the glass, the company says that these UV-A LEDs maintain good reliability even in high temperature and high humidity environments. According to the company, this encapsulation minimizes the impact of gas penetration and moisture on the LED die. The encapsulation also allows high-density mounting.
An improved crystal structure raises the light output per LED die compared to previous versions. Also, the use of flip-chip technology that directly connects the LED die to the substrate enables smaller product size. These improvements help the UV-LEDs achieve light output per unit area of 200 mW/mm2, more than twice the output density of the company’s previous UV-LEDs.
Toyoda Gosei is showcasing these products at the Optics & Photonics International Exhibition, which is being held April 19-21 at the Pacifico Yokohama Conference Center, Japan.