InteGreat Project Develops New LED Production Approaches

For the InteGreat research project, Osram Opto Semiconductors coordinated a consortium of seven partners from science and industry. Beginning in December 2014 and continuing until February of this year the project partners closely examined conventional manufacturing approaches and know-how along the entire LED production process with the goal of finding potential measures for further optimization. According to Osram Opto Semiconductors, the new findings from the allow the fabrication of LED products with superior properties that would have been difficult or even impossible to obtain with the previous LED production technologies.

Osram Opto Semiconductors, Osram, the Fraunhofer Institute for Integrated Systems and Device Technology (IISB), the Fraunhofer Institute for Reliability and Microintegration (IZM), Würth Elektronik, LayTec AG, and Mühlbauer GmbH & Co KG looked for new approaches for manufacturing minuscule surface emitting LED chips and packaging technologies, among other things, as part of the “Photonic Process Chains” initiative.

InteGreat Project -- Photonic Process Chains Initiative- develops methods for producing miniscule LEDs and LED packaging technologies.

InteGreat Project — Photonic Process Chains Initiative- develops methods for producing miniscule LEDs and LED packaging technologies.

InteGreat Project Targeted New Connecting and Packaging Technologies

The InteGreat Project also focused on developing new connecting technologies. One pioneering approach that emerged from the project is planar interconnect technology. Planar interconnect technology offers numerous advantages especially in applications such as video wall fabrication.

The further development of wafer level packaging techniques as well as investigations into planar contacts were primary focuses of the project.

One of the unique techniques to emerge from the project is planar interconnect technology which replaces the bond wire with a thin flat metal connection. This design places the surface emitter on the surface of the package. The light can, therefore, be utilized more directly, unlike with standard components. This design also results in smaller losses in output and efficiency and consequently produces increased brilliance and improves operational cost savings.

InteGreat Project develops planar interconnect technology.

InteGreat Project develops and demonstrates planar interconnect technology.

InteGreat Project Demonstrates 1mm Pixel Pitch Video Wall Modules

The project participants also successfully demonstrated video wall modules with a pixel pitch of 1 mm. In addition to being applicable to large format video walls, Osram Opto Semiconductors says that the project results are applicable to new LED applications including ambient lighting and sensor systems. The company says that due to the project’s modular structure comprised of four work packages, many results can now be rapidly transitioned into product development and production.

The InteGreat Project participants also see the potential for the project’s developments for integrating LEDs into industrial applications and future mobility applications. Additionally, Osram Opto Semiconductor says that the results open up tremendous potential in infotainment.

“The results of the InteGreat research project represent a major advance for the future of LEDs. Our powerful consortium of partners from science and industry has delivered extraordinary achievements in three years. Once again we have been able to demonstrate the powers of innovation in Germany as a center of scientific know-how,” said Frank Singer, Predevelopment Group Leader at Osram Opto Semiconductors.

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